Pulse Heat Bonding Machine PCB Soldering Machine Hotbar Machine
Pulse Heat Bonding Machine Principle:
The hot bar power supply provide the current to heat the thermode
which is high resistivity such as W,Mo,Ti. The temperature climb up
to a certain value to melt theTIN and the solder, when the
temperature drop down, the workpiece is connected by the TIN. A
pressure is working through all the process and the temperature is
accurately controlled by the IGBT inverter power supply.
Pulse Heat Bonding Machine Features:
Unique pulse heat technology provides fastest soldering head
heating.
Programmable soldering temperature, heat-up rate and time duration
for a wide range of products.
Thermocouple is fixed in close proximity to the working surface &
the thermode, thus providing accurate temperature feedback control.
Closed Loop PID temperature control with clearly visible LED
display.
Soldering time can be programmable and is triggered by temperature.
Floating thermode ensures consistent pressure and heat transfer
between the thermode head and the parts to be joined.
Programmable pressure switch with LCD display for precise force
control.
CCD camera system with magnification lens can be retrofitted for
fine-pitch positioning.
Pulse Heat Bonding Machine Specification:
| Machine size | 680×780×750mm |
| Working area | Max 200*260mm |
| Machine weight | 135Kg |
| Working air pressure | 0.4-0.6Mpa |
| Fixture quantity | 2 |
| Thermode head size | Max 80*5mm |
| Welding precision | pitch 0.2mm |
| Pressing time | 1~99.9s |
| Temperature settings | RT~500℃ tolerance ±5℃ |
| Welding pressure | 1~20Kg |
| Temperature settings | Two |
| Working environment | 10-60℃,40%-95% |
| Power supply | AC220V±10% 50HZ,2200W |
| Alignment mode | CCD + LCD Monitor |
| Feeding mode | Manual |
| Starting mode | Press start button |
| Rotation Platform | Cylinder control,tolerance<0.02mm |
Pulse Heat Bonding Machine Details:
Pulse Heat Bonding Machine Applications:
Heat Sealing Paratmeter:
1. Temperature range: 50℃ to 600℃
2. Temperature accuracy: ±1°C
3. Bond timer: 0-12 seconds
4. Bond air pressure: 0.4-0.6MPa
5. Pressure accuracy: ±0.05MPa
6. Max bond force: 1100N
