300x300mm Dust Free No Stress UV Laser PCB Depaneling Machine
UV Laser PCB Depaneling Machine Overview:
A UV Laser PCB Depaneling Machine is a high-precision system used
to separate (depanel) individual printed circuit board units from a
larger panel without mechanical stress or contamination. The 300mm
× 300mm working area makes this machine suitable for medium-sized
PCBs used in mobile devices, medical devices, automotive
electronics, and more.
Unlike traditional depaneling methods (e.g., routing, punching, or
V-cutting), this machine uses a UV laser to cleanly and accurately
cut through PCB substrates (FR4, polyimide, etc.) with no
mechanical contact, ensuring no stress, no dust, and no
delamination.
UV Laser PCB Depaneling Machine Features:
300×300mm Working Area: Supports medium-sized PCB panels with high
flexibility.
UV Laser Cutting: Uses a 355 nm UV laser for high-precision,
low-thermal-impact cutting.
No Mechanical Stress: No contact means no micro-cracks or component
damage during depaneling.
Dust-Free Operation: No routing or sawing = zero dust and no need
for post-cleaning.
High Precision & Accuracy: Cutting accuracy typically ±10 μm or
better.
Vision System: CCD camera for fiducial recognition and dynamic
alignment.
Programmable Cut Paths: Supports DXF/Gerber file import for complex
board outlines.
Low Heat-Affected Zone (HAZ): UV laser minimizes thermal stress and
carbonization.
Safety Enclosure: Fully enclosed design with laser shielding and
interlock protection.
Auto Mark Alignment: Ensures perfect alignment for repeated,
precision cuts.
UV Laser PCB Depaneling Machine Specifications:
| Model | SMTL300, dual tables |
| Power | 380V AC, 50Hz, 20A |
| Compressed Air | Compressed air |
| Machine Dimension | 1450(L)x1350(W)x1665(H)mm |
| Installation Space | 3000x3000x2500mm |
| Machine Weight | 800kgs |
| Ambient Temperature | 22 ~ 25 ℃ |
| temperature variation | within ± 1 ℃ / 24hr |
| ambient humidity | within 40% ~ 70% (no obvious condensation is allowed) |
| Dust free grade | 100000 or better |
| power consumption | 6KW |
| Cutting width | ≤ 50mm × 50mm |
| Cutting materials | full cut / half cut of PCB / FPC, LCP / glue and other related
materials |
| Cutting thickness | ≤ 3mm |
| Cutting speed | ≤ 3000mm / S |
| Overall machining accuracy | ≤ 30um |
| Processing pattern | straight line, slash, curve, abnormity, etc |
| Laser | 355nm light wave nanosecond laser |
| Repetition frequency | 50-150khz |
| Laser Power | UV 15W@30KHz |
| Pulse width | < 20ns |
| Energy stability | < 3% RMS over 8hours |
| Beam quality m ² | < 1.3 |
| Mode | 2500mm/S |
| Warranty | 1 year |
| Service | Oversea training is available |
UV Laser PCB Depaneling Machine Advantages:
UV Laser PCB Depaneling Machine is a high-precision, non-contact
depaneling solution designed for cutting, drilling, and marking
printed circuit boards (PCBs). It is widely used in electronics,
medical devices, automotive, aerospace, and telecommunications
industries where high precision and minimal stress are required.
It is used in PCB depaneling due to its short wavelength (355nm)
and high absorption efficiency in PCB materials like FR4,
polyimide, ceramics, and aluminum-backed substrates. This ensures
clean, precise cuts with minimal thermal impact.
UV Laser PCB Depaneling Machine Applications:
Smartphone and tablet PCBs
Wearable device electronics (smartwatches, fitness bands)
Medical and implantable devices
Automotive ADAS and infotainment boards
High-density rigid-flex PCBs
LED panel and lighting module depaneling
