±2°C Precision Automatic Soldering Machine with Molybdenum Alloy
Thermode
Mini Automatic Soldering Machine Introduction:
A Mini Hot Bar Soldering Machine is a compact, high-precision
soldering system designed for bonding flexible printed circuits
(FPC), flat flexible cables (FFC), or tiny wires to miniature LCD
displays (such as those in smartphones, tablets, smartwatches, or
handheld devices).
It uses the hot bar soldering technique — applying controlled heat
and pressure via a custom-shaped thermode to form reliable
electrical and mechanical connections.
Mini Automatic Soldering Machine Features:
1. Use pulse heating technology, the temperature control is
accurate, and the temperature sampling frequency is 0.1s
2. Multi stage temperature rise control, ±2℃ soldering precision
3. Real time temperature curve display
4. High precision soldering, ensures consistent solder joints with
accurate temperature and positioning.
5. Automatic wire feeding: feeds and positions wires automatically
for efficient operation.
6. Programmable operation: offers customizable soldering patterns,
timing, and temperature profiles.
Mini Automatic Soldering Machine Specification:
| Machine size | 500×500×600mm |
| Working area | Max 200*170mm |
| Machine weight | 62Kg |
| Working air pressure | 0.6-0.8Mpa |
| Fixture quantity | 1 |
| Thermode head size | Max 40*3mm |
| Welding precision | pitch 0.2mm |
| Pressing time | 1~99.9s |
| Temperature settings | RT~500℃ tolerance ±5℃ |
| Welding pressure | 1~20Kg |
| Temperature settings | Two |
| Working environment | 10-60℃,40%-95% |
| Power supply | AC220V±10% 50HZ,2200W |
| Alignment mode | CCD + LCD Monitor |
| Feeding mode | Manual |
| Starting mode | Press start button |
| Rotation Platform | Cylinder control,tolerance<0.02mm |
| Thermode material | Molybdenum alloy |
| Thermode size | Max 60mm long |
| Origin | China |
| Fixing mode | Customized fixture |
| Application | FFC to PCB, FPC to PCB, Wires to PCB |
| Warranty | 12 months |
Mini Automatic Soldering Machine Functions:
Soldering FPC/FFC to LCD panels (COF/COG bonding)
ACF (Anisotropic Conductive Film) bonding
Wire-to-PCB or wire-to-LCD module soldering
Thermode heating and cooling cycle control
Force application during bonding process
Precision alignment of LCD and flex circuit
Mini Automatic Soldering Application:
Mobile phone LCD module assembly
Smartwatch or wearable display soldering
Tablet and e-reader display bonding
Automotive cluster and infotainment screen assembly
Medical device displays
Small-scale prototyping and R&D
